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* Special Issue on Codesign for SoC (Intl Journal of Embedded Systems)
@ 2003-11-20  7:52 Pao-Ann Hsiung
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From: Pao-Ann Hsiung @ 2003-11-20  7:52 UTC (permalink / raw)
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International Journal of Embedded Systems
Inderscience Publishers)

Special Issue On Hardware-Software Codesign for Systems-on-Chip

With the rapidly permeating global trend of adopting SoC (System-on-Chip) 
design technologies, traditional hardware-software codesign techniques 
need adaptation and revamping to satisfy the growing needs of complex 
system designs. This special issue is devoted to presenting 
state-of-the-art SoC codesign and coverification methodologies, 
languages, techniques, tools, system architectures, and related 
technologies. Prospective papers should be unpublished and present solid 
research work offering innovative contributions either from a 
methodological or application point of view.

Topics of interest include (but are not limited to):

* Design & Verification Methodologies
* Design & Verification Languages
* Design & Verification Tools
* SoC Architectural Issues
* SoC Physical Impact on Codesign
* Nanotechnology and Codesign
* Mixed-Signal in Codesign
* Soft/Hard IP-reuse in Codesign
* Embedded Software Issues
* Embedded Hardware Issues
* Communication Issues
* Cosimulation Techniques
* (Semi)-Formal Verification
* Platform-Based Codesign Issues

Prospective authors should follow the Inderscience IJES manuscript format 
described at the Journal site An electronic 
copy of the complete manuscript in PDF format is to be submitted by e-mail 
to Pao-Ann Hsiung at, according to the following schedule.

Manuscript due:          December 1, 2003
Acceptance notification: January 16, 2004
Final manuscript due:    January 31, 2004
Publication date:        June 2004

Guest Editor
Prof. Pao-Ann Hsiung
Department of Computer Science and Information Engineering
National Chung Cheng University
Chiayi 621, Taiwan

Editorial Board for this Special Issue: (ordered alphabetically)
Jih-Ming Fu, Cheng-Shiu University of Technology, Taiwan
Rajesh Gupta, University of California, Irvine, USA
Thomas Henzinger, University of California, Berkeley, USA
Luciano Lavagno, Politecnico di Torino, Italy
Trong-Yen Lee, National Taipei University of Technology, Taiwan
Win-Bin See, Aerospace Industrial Development Corporation, Taiwan
Wayne Wolf, Princeton University, USA

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