From mboxrd@z Thu Jan 1 00:00:00 1970 Return-Path: Received: (qmail 29894 invoked by alias); 20 Nov 2003 07:52:11 -0000 Mailing-List: contact c++-embedded-help@sources.redhat.com; run by ezmlm Precedence: bulk List-Subscribe: List-Archive: List-Post: List-Help: , Sender: c++-embedded-owner@sources.redhat.com Received: (qmail 29885 invoked from network); 20 Nov 2003 07:52:09 -0000 Received: from unknown (HELO csmail.cs.ccu.edu.tw) (140.123.101.188) by sources.redhat.com with SMTP; 20 Nov 2003 07:52:09 -0000 Received: from localhost (localhost.cs.ccu.edu.tw [127.0.0.1]) by csmail.cs.ccu.edu.tw (Postfix) with ESMTP id 5003B1CE631 for ; Thu, 20 Nov 2003 15:52:23 +0800 (CST) Received: by csmail.cs.ccu.edu.tw (Postfix, from userid 65534) id 0F5461CE642; Thu, 20 Nov 2003 15:52:23 +0800 (CST) Received: from paoann (paoann.cs.ccu.edu.tw [140.123.101.34]) by csmail.cs.ccu.edu.tw (Postfix) with SMTP id D42591CE631 for ; Thu, 20 Nov 2003 15:52:22 +0800 (CST) Message-ID: <001d01c3af3b$30ed86b0$22657b8c@paoann> Reply-To: "Pao-Ann Hsiung" From: "Pao-Ann Hsiung" To: Subject: Special Issue on Codesign for SoC (Intl Journal of Embedded Systems) Date: Thu, 20 Nov 2003 07:52:00 -0000 Organization: National Chung Cheng University, CSIE MIME-Version: 1.0 Content-Type: text/plain; charset="big5" Content-Transfer-Encoding: 7bit X-Priority: 3 X-MSMail-Priority: Normal X-MimeOLE: Produced By Microsoft MimeOLE V6.00.2800.1165 X-Spam-Checker-Version: SpamAssassin 2.60 (1.212-2003-09-23-exp) on csmail.cs.ccu.edu.tw X-Spam-Report: X-Spam-Status: No, hits=0.0 required=10.0 tests=none autolearn=no version=2.60 X-Virus-Scanned: by AMaViS snapshot-20020531 X-SW-Source: 2003/txt/msg00000.txt.bz2 [Apologies for cross postings. Please re-distribute.] CALL FOR PAPERS International Journal of Embedded Systems (http://www.inderscience.com/catalogue/e/ijes/indexijes.html, Inderscience Publishers) Special Issue On Hardware-Software Codesign for Systems-on-Chip (http://www.cs.ccu.edu.tw/~pahsiung/ijes-codesign/) With the rapidly permeating global trend of adopting SoC (System-on-Chip) design technologies, traditional hardware-software codesign techniques need adaptation and revamping to satisfy the growing needs of complex system designs. This special issue is devoted to presenting state-of-the-art SoC codesign and coverification methodologies, languages, techniques, tools, system architectures, and related technologies. Prospective papers should be unpublished and present solid research work offering innovative contributions either from a methodological or application point of view. Topics of interest include (but are not limited to): * Design & Verification Methodologies * Design & Verification Languages * Design & Verification Tools * SoC Architectural Issues * SoC Physical Impact on Codesign * Nanotechnology and Codesign * Mixed-Signal in Codesign * Soft/Hard IP-reuse in Codesign * Embedded Software Issues * Embedded Hardware Issues * Communication Issues * Cosimulation Techniques * (Semi)-Formal Verification * Platform-Based Codesign Issues Prospective authors should follow the Inderscience IJES manuscript format described at the Journal site http://www.inderscience.com/catalogue/e/ijes/indexijes.html. An electronic copy of the complete manuscript in PDF format is to be submitted by e-mail to Pao-Ann Hsiung at hpa@computer.org, according to the following schedule. Manuscript due: December 1, 2003 Acceptance notification: January 16, 2004 Final manuscript due: January 31, 2004 Publication date: June 2004 Guest Editor Prof. Pao-Ann Hsiung Department of Computer Science and Information Engineering National Chung Cheng University Chiayi 621, Taiwan hpa@computer.org Editorial Board for this Special Issue: (ordered alphabetically) Jih-Ming Fu, Cheng-Shiu University of Technology, Taiwan Rajesh Gupta, University of California, Irvine, USA Thomas Henzinger, University of California, Berkeley, USA Luciano Lavagno, Politecnico di Torino, Italy Trong-Yen Lee, National Taipei University of Technology, Taiwan Win-Bin See, Aerospace Industrial Development Corporation, Taiwan Wayne Wolf, Princeton University, USA